Our Semiconductor Post-process Equipment Project was hornored as Shenzhen Government High-tech Project and affirmed as Shenzhen High-tech Enterprise in 2007.
June’s CT-2100 automatic bonding machine control software V21.1.1, June’s automatic bonding machine control software V5.17 and June’s automatic die bonder control software V1.01 obtained software product registration rights. Over ten software copyrights are applying.
Utility model: High-speed pick and place machine with multi-head turret mechanism, patent authorization number: ZL2006 2 0013049.1
Utility model: Seven-track high-speed quality separating XY work table, patent authorization number: ZL2006 2 0013048.7
Utility model: Full closed loop high-precision servo rotary work table, patent authorization number: ZL2006 2 0012719.8
Invention patent: High-speed pick and place machine with multi-head turret mechanism, patent authorization number: 200610062797.3
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